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Wu, Development of substrat integrated waveguide power dividers. IEEE Antennas and Propagation Society International Symposium, 1A (3–8), 639–642 (2005) Wu, Multiway broadband substrate integrated waveguide (SIW) power divider. Wu, A new six-port junction based on substrate integrated waveguide technology. Wu, W-Band Multiport Substrate-Integrated Waveguide Circuits. Wu, Low cost microwave oscillator using substrate integrated waveguide cavity. Wu, Analysis and Design of Current Probe Transition From Grounded Coplanar to Substrate Integrated Rectangular Waveguides. Wu, Substrate integrated waveguide (SIW) linear phase filter, IEEE Microw. Robertson, W-band substrate integrated waveguide slot antenna. Wu et al, Investigations on the propagation characteristics of the substrate integrated waveguide based on the method of lines.
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Takenoshita, Development of a laminated waveguide. The simplified model and design procedure for this compact SIW power dividing/combining structure is discussed. In this paper, a new design method for Ka-band multi-way SIW power divider/combiner has been proposed. The reported Ku-band four-way power divider/combiner design has demonstrated low insertion loss (0.3 dB). Recently, we have proposed a novel radial cavity power divider based on the substrate integrated waveguide (SIW) technology. limit the application for multi-way power dividers/combiners. However, some disadvantages such as high insertion loss, low power-combining efficiency etc. Several SIW power dividers/combiners have been studied in and some good performances are reported. A number of integrated components have been developed including numerous transitions, filters, and oscillators. Therefore, it is possible to design microwave and millimeter wave components with good performance using the SIW technique.
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The field distribution in an SIW is similar to that in a conventional metallic waveguide, and the transitions of the SIW are designed on the same substrate, thus eliminating any mechanical assembling. In view of the above advantages, it is an appropriate choice for realizing components in microwave and millimeter wave integrated circuits. Compared with microstrip-like structures, it has higher Q-factor. The SIW is synthesized in a planar substrate with arrays of metallic via, and can be fabricated by standard printed circuit boards (PCBs) or the low temperature cofired ceramics (LTCC) process. Recently, a convenient and interesting planar integration scheme called substrate integrated waveguide (SIW) has already attracted much interest. New technologies of passive components always stimulate the design of microwave devices including power dividers/combiners. However, conventional technologies for designing high-quality passive power dividers/combiners, including a metal waveguide or microstrip line, are either too expensive or not able to provide required performances. With the rapid advancements of military and commercial communications systems in recent years, the demand for power dividers/combiners has greatly increased.